Path Engineering
RoleAs a Bond Puller (also known as Microelectronic Assembler, RF Integrated Circuit Fabricator), you'll be part of a world-class production team.
Your role will involve fabricating and modifying complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies.
You'll follow specific instructions for wire and ribbon bonding, utilizing both manual and automatic bonding machines.
BenefitsContribute to life-saving and democracy-defending products.
Be part of an elite, world-class production team.
Opportunity to work on a flexible 4/10 schedule, 2:
30pm - 1:
00am.
QualificationsHigh school diploma.
3
years of Microelectronic assembly with some bonding experience with manual and/or auto wedge ball bonding.
Ability to work with a microscope for an entire shift and excellent hand-eye coordination.
Familiarity with MIL-STD-883 and manual gold ball and ribbon bonding.
Experience working with bonding complex microwave modules.
Proficiency in Die Attach/Bonding and Mechanical Assembly Skills.
Experience with Wire Bonding Machine.
Preferred:
Experience with Westbond and Dage 4000 bond pull equipment and automatic bonding equipment such as Palomar 8000/8100/9000 ball bonders and wedge bonders.
Note:
This position requires access to information subject to U.
S.
export regulations.
Applicants must be U.
S.
citizens, lawful permanent residents of the U.
S.
, protected individuals as defined by 8 U.
S.
C.
1324b(a)(3), or eligible to obtain the required authorizations from the U.
S.
government.
About the Company:
Path Engineering.
Estimated Salary: $20 to $28 per hour based on qualifications.
Your role will involve fabricating and modifying complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies.
You'll follow specific instructions for wire and ribbon bonding, utilizing both manual and automatic bonding machines.
BenefitsContribute to life-saving and democracy-defending products.
Be part of an elite, world-class production team.
Opportunity to work on a flexible 4/10 schedule, 2:
30pm - 1:
00am.
QualificationsHigh school diploma.
3
years of Microelectronic assembly with some bonding experience with manual and/or auto wedge ball bonding.
Ability to work with a microscope for an entire shift and excellent hand-eye coordination.
Familiarity with MIL-STD-883 and manual gold ball and ribbon bonding.
Experience working with bonding complex microwave modules.
Proficiency in Die Attach/Bonding and Mechanical Assembly Skills.
Experience with Wire Bonding Machine.
Preferred:
Experience with Westbond and Dage 4000 bond pull equipment and automatic bonding equipment such as Palomar 8000/8100/9000 ball bonders and wedge bonders.
Note:
This position requires access to information subject to U.
S.
export regulations.
Applicants must be U.
S.
citizens, lawful permanent residents of the U.
S.
, protected individuals as defined by 8 U.
S.
C.
1324b(a)(3), or eligible to obtain the required authorizations from the U.
S.
government.
About the Company:
Path Engineering.
Estimated Salary: $20 to $28 per hour based on qualifications.
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